2018/2947(DEA) Exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
Lead committee dossier:
Progress: Procedure completed - delegated act enters into force
Role | Committee | Rapporteur | Shadows |
---|---|---|---|
Lead | ENVI |
Lead committee dossier:
Subjects
Events
2019/01/24
EP - Delegated act not objected by Parliament
2018/11/28
EP - Committee referral announced in Parliament
2018/11/16
EC - Non-legislative basic document
Documents
2018/11/16
EC - Non-legislative basic document published
Documents
2018/11/16
EP/CSL - Initial period for examining delegated act 2 month(s)
Documents
- Non-legislative basic document: C(2018)07499
- Non-legislative basic document published: C(2018)07499
- Non-legislative basic document: C(2018)07499
History
(these mark the time of scraping, not the official date of the change)
2022-08-01Show (1) Changes | Timetravel
events/2/type |
Old
Committee referral announced in Parliament, 1st reading/single readingNew
Committee referral announced in Parliament |
2022-05-04Show (1) Changes | Timetravel
events/2/type |
Old
Committee referral announced in ParliamentNew
Committee referral announced in Parliament, 1st reading/single reading |
2022-04-27Show (1) Changes | Timetravel
events/2/type |
Old
Committee referral announced in Parliament, 1st reading/single readingNew
Committee referral announced in Parliament |
2020-12-09Show (1) Changes | Timetravel
procedure/stage_reached |
Old
Awaiting Council decision on delegated actNew
Procedure completed - delegated act enters into force |
2019-08-07Show (1) Changes | Timetravel
committees/0/date |
|
2019-07-06Show (12) Changes | Timetravel
activities |
|
committees/0 |
|
committees/0 |
|
docs |
|
events |
|
links |
|
other |
|
procedure/dossier_of_the_committee |
Old
ENVI/8/15029New
|
procedure/stage_reached |
Old
Awaiting committee decisionNew
Awaiting Council decision on delegated act |
procedure/subject |
Old
New
|
procedure/summary |
|
procedure/title |
Old
Amending Annex III to Directive 2011/65/EU as regards an exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packagesNew
Exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages |
2018-12-05Show (5) Changes
activities |
|
committees |
|
links |
|
other |
|
procedure |
|